Split-gate memory cells

ABSTRACT

Memory might include an array of memory cells having a plurality of strings of series-connected split-gate memory cells each including a primary memory cell portion and an assist memory cell portion, a plurality of primary access lines each connected to a control gate of the primary memory cell portion of a respective split-gate memory cell of each string of series-connected split-gate memory cells of the plurality of strings of series-connected split-gate memory cells, and a plurality of assist access lines each connected to a control gate of the assist memory cell portion of its respective split-gate memory cell of each string of series-connected split-gate memory cells of the plurality of strings of series-connected split-gate memory cells.

This application claims the benefit of U.S. Provisional Application No.63/131,340, filed on Dec. 29, 2020, hereby incorporated herein in itsentirety by reference.

TECHNICAL FIELD

The present disclosure relates generally to integrated circuits, and, inparticular, in one or more embodiments, the present disclosure relatesto apparatus including split-gate memory cells, and methods of theiroperation.

BACKGROUND

Memories (e.g., memory devices) are typically provided as internal,semiconductor, integrated circuit devices in computers or otherelectronic devices. There are many different types of memory includingrandom-access memory (RAM), read only memory (ROM), dynamic randomaccess memory (DRAM), synchronous dynamic random access memory (SDRAM),and flash memory.

Flash memory has developed into a popular source of non-volatile memoryfor a wide range of electronic applications. Flash memory typically usea one-transistor memory cell that allows for high memory densities, highreliability, and low power consumption. Changes in threshold voltage(Vt) of the memory cells, through programming (which is often referredto as writing) of charge storage structures (e.g., floating gates orcharge traps) or other physical phenomena (e.g., phase change orpolarization), determine the data state (e.g., data value) of eachmemory cell. Common uses for flash memory and other non-volatile memoryinclude personal computers, personal digital assistants (PDAs), digitalcameras, digital media players, digital recorders, games, appliances,vehicles, wireless devices, mobile telephones, and removable memorymodules, and the uses for non-volatile memory continue to expand.

A NAND flash memory is a common type of flash memory device, so calledfor the logical form in which the basic memory cell configuration isarranged. Typically, the array of memory cells for NAND flash memory isarranged such that the control gate of each memory cell of a row of thearray is connected together to form an access line, such as a word line.Columns of the array include strings (often termed NAND strings) ofmemory cells connected together in series between a pair of selectgates, e.g., a source select transistor and a drain select transistor.Each source select transistor may be connected to a source, while eachdrain select transistor may be connected to a data line, such as columnbit line. Variations using more than one select gate between a string ofmemory cells and the source, and/or between the string of memory cellsand the data line, are known.

In programming memory, memory cells might be programmed as what areoften termed single-level cells (SLC). SLC may use a single memory cellto represent one digit (e.g., one bit) of data. For example, in SLC, aVt of 2.5V or higher might indicate a programmed memory cell (e.g.,representing a logical 0) while a Vt of −0.5V or lower might indicate anerased memory cell (e.g., representing a logical 1). Such memory mightachieve higher levels of storage capacity by including multi-level cells(MLC), triple-level cells (TLC), quad-level cells (QLC), etc., orcombinations thereof in which the memory cell has multiple levels thatenable more digits of data to be stored in each memory cell. Forexample, MLC might be configured to store two digits of data per memorycell represented by four Vt ranges, TLC might be configured to storethree digits of data per memory cell represented by eight Vt ranges, QLCmight be configured to store four digits of data per memory cellrepresented by sixteen Vt ranges, and so on.

Sensing (e.g., reading or verifying) a data state of a target memorycell often involves detecting whether the target memory cell isactivated in response to a particular voltage level applied to itscontrol gate, such as by detecting whether a data line connected to thetarget memory cell experiences a change in voltage level caused bycurrent flow through the memory cell. This typically includes applying avoltage level to the control gate of each remaining memory cell of astring of series-connected memory cells containing the target memorycell that is expected to activate each of these remaining memory cellsregardless of their data state. Such a voltage level might be referredto as a pass voltage. However, some memory cells may be over programmed,e.g., having a threshold voltage level higher than desired, and may notbe activated in response to the pass voltage being applied to theircontrol gate. This can lead to an inaccurate determination of the datastate of the target memory cell where the target memory cell might bedeemed to be deactivated even if it were activated.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of a memory in communication with aprocessor as part of an electronic system, according to an embodiment.

FIGS. 2A-2C are schematics of portions of an array of memory cells ascould be used in a memory of the type described with reference to FIG.1.

FIG. 3A is a schematic of a split-gate memory cell in accordance with anembodiment.

FIGS. 3B-3C plan views of split-gate memory cells in accordance withembodiments.

FIG. 4A is a perspective view of an array structure in accordance withan embodiment.

FIG. 4B is a plan view of an array structure of FIG. 4A in accordancewith an embodiment.

FIG. 5 is a cross-sectional view of a portion of an array of split-gatememory cells in accordance with an embodiment.

FIG. 6 is a schematic of a portion of an array of memory cells andstring drivers as could be used in a memory device of the type describedwith reference to FIG. 1.

FIGS. 7A-7B are conceptual depictions of threshold voltage distributionsof a plurality of memory cells for use with embodiments.

FIG. 8 depicts a flowchart of a method of operating a memory accordingto an embodiment.

FIG. 9 depicts a flowchart of a method of operating a memory accordingto another embodiment.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof, and in which is shown, byway of illustration, specific embodiments. In the drawings, likereference numerals describe substantially similar components throughoutthe several views. Other embodiments might be utilized and structural,logical and electrical changes might be made without departing from thescope of the present disclosure. The following detailed description is,therefore, not to be taken in a limiting sense.

The term “semiconductor” used herein can refer to, for example, a layerof material, a wafer, or a substrate, and includes any basesemiconductor structure. “Semiconductor” is to be understood asincluding silicon-on-sapphire (SOS) technology, silicon-on-insulator(SOI) technology, thin film transistor (TFT) technology, doped andundoped semiconductors, epitaxial layers of a silicon supported by abase semiconductor structure, as well as other semiconductor structureswell known to one skilled in the art. Furthermore, when reference ismade to a semiconductor in the following description, previous processsteps might have been utilized to form regions/junctions in the basesemiconductor structure, and the term semiconductor can include theunderlying layers containing such regions/junctions.

The term “conductive” as used herein, as well as its various relatedforms, e.g., conduct, conductively, conducting, conduction,conductivity, etc., refers to electrically conductive unless otherwiseapparent from the context. Similarly, the term “connecting” as usedherein, as well as its various related forms, e.g., connect, connected,connection, etc., refers to electrically connecting unless otherwiseapparent from the context.

It is recognized herein that even where values might be intended to beequal, variabilities and accuracies of industrial processing andoperation might lead to differences from their intended values. Thesevariabilities and accuracies will generally be dependent upon thetechnology utilized in fabrication and operation of the integratedcircuit device. As such, if values are intended to be equal, thosevalues are deemed to be equal regardless of their resulting values.

Various embodiments disclosed herein include memories having split-gatememory cells, each having a primary memory cell portion and an assistmemory cell portion. Data may be written to a primary memory cellportion during a programming operation in response to a write commandand its associated data, and may be read from the primary memory cellportion during a read operation in response to a read command for outputof that data. The assist memory cell portion may be inaccessible duringnormal operation of the memory and may store predetermined data, e.g., apredetermined range of threshold voltages. For example, each assistmemory cell portion might have a threshold voltage in a predefined rangeof threshold voltages. As used herein, a read operation, which includesoutput of read data from the memory, is distinguished from a verifyoperation, which is utilized during a programming or erase operation todetermine whether a memory cell has an intended data state, and does notinclude output of data from the memory during normal operation.

FIG. 1 is a simplified block diagram of a first apparatus, in the formof a memory (e.g., memory device) 100, in communication with a secondapparatus, in the form of a processor 130, as part of a third apparatus,in the form of an electronic system, according to an embodiment. Someexamples of electronic systems include personal computers, personaldigital assistants (PDAs), digital cameras, digital media players,digital recorders, games, appliances, vehicles, wireless devices, mobiletelephones and the like. The processor 130, e.g., a controller externalto the memory device 100, might be a memory controller or other externalhost device.

Memory device 100 includes an array of memory cells 104 that might belogically arranged in rows and columns. The array of memory cells 104includes strings of series-connected split-gate memory cells inaccordance with an embodiment. Memory cells of a logical row aretypically connected to the same access line (commonly referred to as aword line) while memory cells of a logical column are typicallyselectively connected to the same data line (commonly referred to as abit line). A single access line might be associated with more than onelogical row of memory cells and a single data line might be associatedwith more than one logical column. Memory cells (not shown in FIG. 1) ofat least a portion of array of memory cells 104 are capable of beingprogrammed to one of at least two target data states.

In the example of FIG. 1, a row decode circuitry 108 and a column decodecircuitry 110 are provided to decode address signals. Address signalsare received and decoded to access the array of memory cells 104. Memorydevice 100 also includes input/output (I/O) control circuitry 112 tomanage input of commands, addresses and data to the memory device 100 aswell as output of data and status information from the memory device100. An address register 114 is in communication with I/O controlcircuitry 112 and row decode circuitry 108 and column decode circuitry110 to latch the address signals prior to decoding. A command register124 is in communication with I/O control circuitry 112 and control logic116 to latch incoming commands.

A controller (e.g., the control logic 116 internal to the memory device100) controls access to the array of memory cells 104 in response to thecommands and may generate status information for the external processor130, i.e., control logic 116 is configured to perform access operations(e.g., sensing operations [which might include read operations andverify operations], programming operations and/or erase operations) onthe array of memory cells 104. The control logic 116 is in communicationwith row decode circuitry 108 and column decode circuitry 110 to controlthe row decode circuitry 108 and column decode circuitry 110 in responseto the addresses. The control logic 116 might include instructionregisters 128 which might represent computer-usable memory for storingcomputer-readable instructions. For some embodiments, the instructionregisters 128 might represent firmware. Alternatively, the instructionregisters 128 might represent a grouping of memory cells, e.g., reservedblock(s) of memory cells, of the array of memory cells 104.

Control logic 116 might also be in communication with a cache register118. Cache register 118 latches data, either incoming or outgoing, asdirected by control logic 116 to temporarily store data while the arrayof memory cells 104 is busy writing or reading, respectively, otherdata. During a programming operation (e.g., write operation), data mightbe passed from the cache register 118 to the data register 120 fortransfer to the array of memory cells 104; then new data might belatched in the cache register 118 from the I/O control circuitry 112.During a read operation, data might be passed from the cache register118 to the I/O control circuitry 112 for output to the externalprocessor 130; then new data might be passed from the data register 120to the cache register 118. The cache register 118 and/or the dataregister 120 might form (e.g., might form a portion of) a page buffer ofthe memory device 100. A page buffer might further include sensingdevices (not shown in FIG. 1) to sense a data state of a memory cell ofthe array of memory cells 104, e.g., by sensing a state of a data lineconnected to that memory cell. A status register 122 might be incommunication with I/O control circuitry 112 and control logic 116 tolatch the status information for output to the processor 130.

Memory device 100 receives control signals at control logic 116 fromprocessor 130 over a control link 132. The control signals might includea chip enable CE#, a command latch enable CLE, an address latch enableALE, a write enable WE#, a read enable RE#, and a write protect WP#.Additional or alternative control signals (not shown) might be furtherreceived over control link 132 depending upon the nature of the memorydevice 100. Memory device 100 receives command signals (which representcommands), address signals (which represent addresses), and data signals(which represent data) from processor 130 over a multiplexedinput/output (I/O) bus 134 and outputs data to processor 130 over I/Obus 134.

For example, the commands might be received over input/output (I/O) pins[7:0] of I/O bus 134 at I/O control circuitry 112 and might then bewritten into command register 124. The addresses might be received overinput/output (I/O) pins [7:0] of I/O bus 134 at I/O control circuitry112 and might then be written into address register 114. The data mightbe received over input/output (I/O) pins [7:0] for an 8-bit device orinput/output (I/O) pins [15:0] for a 16-bit device at I/O controlcircuitry 112 and then might be written into cache register 118. Thedata might be subsequently written into data register 120 forprogramming the array of memory cells 104. For another embodiment, cacheregister 118 might be omitted, and the data might be written directlyinto data register 120. Data might also be output over input/output(I/O) pins [7:0] for an 8-bit device or input/output (I/O) pins [15:0]for a 16-bit device. Although reference might be made to I/O pins, theymight include any conductive nodes providing for electrical connectionto the memory device 100 by an external device (e.g., processor 130),such as conductive pads or conductive bumps as are commonly used.

It will be appreciated by those skilled in the art that additionalcircuitry and signals can be provided, and that the memory device 100 ofFIG. 1 has been simplified. It should be recognized that thefunctionality of the various block components described with referenceto FIG. 1 might not necessarily be segregated to distinct components orcomponent portions of an integrated circuit device. For example, asingle component or component portion of an integrated circuit devicecould be adapted to perform the functionality of more than one blockcomponent of FIG. 1. Alternatively, one or more components or componentportions of an integrated circuit device could be combined to performthe functionality of a single block component of FIG. 1.

Additionally, while specific I/O pins are described in accordance withpopular conventions for receipt and output of the various signals, it isnoted that other combinations or numbers of I/O pins (or other I/O nodestructures) might be used in the various embodiments.

FIG. 2A is a schematic of a portion of an array of memory cells 200A,such as a NAND memory array, as could be used in a memory of the typedescribed with reference to FIG. 1, e.g., as a portion of array ofmemory cells 104. Memory array 200A includes primary access lines (e.g.,primary word lines) 202 ₀ to 202 ₃, assist access lines (e.g., assistword lines) 203 ₀ to 203 ₃, and data lines (e.g., bit lines) 204 ₀ to204 ₃. The primary access lines 202 might be connected to global primaryaccess lines (e.g., global primary word lines), not shown in FIG. 2A, ina many-to-one relationship. The assist access lines 202 might beconnected to global assist access lines (e.g., global assist wordlines), not shown in FIG. 2A, in a many-to-one relationship. For someembodiments, memory array 200A might be formed over a semiconductorthat, for example, might be conductively doped to have a conductivitytype, such as a p-type conductivity, e.g., to form a p-well, or ann-type conductivity, e.g., to form an n-well.

Memory array 200A might be arranged in rows (each corresponding to aprimary access line 202 and corresponding assist access line 203) andcolumns (each corresponding to a data line 204). Each column mightinclude a string of series-connected split-gate memory cells (e.g.,split-gate non-volatile memory cells), and might be referred to as aNAND string 206. A NAND string 206 might be connected (e.g., selectivelyconnected) to a common source (SRC) 216 and might include, in theexample of FIG. 2A, memory cells 208 ₀₀ to 208 ₀₃ for NAND string 206 ₀,memory cells 208 ₁₀ to 208 ₁₃ for NAND string 206 ₁, memory cells 208 ₂₀to 208 ₂₃ for NAND string 206 ₂, or memory cells 208 ₃₀ to 208 ₃₃ forNAND string 206 ₃. The memory cells 208 might represent, and may bereferred to as, split-gate memory cells. The memory cells 208 ₀ to 208_(N) might include memory cells intended for storage of data, and mightfurther include other memory cells not intended for storage of data,e.g., dummy memory cells. Dummy memory cells are typically notaccessible to a user of the memory, and are instead typicallyincorporated into a NAND string for operational advantages that are wellunderstood.

The memory cells 208 of each NAND string 206 might be connected inseries between a select gate 210 (e.g., a field-effect transistor), suchas one of the select gates 210 ₀ to 210 ₃ (e.g., that might be sourceselect transistors, commonly referred to as select gate source), and aselect gate 212 (e.g., a field-effect transistor), such as one of theselect gates 212 ₀ to 212 ₃ (e.g., that might be drain selecttransistors, commonly referred to as select gate drain). Select gates210 ₀ to 210 ₃ might be commonly connected to a select line 214, such asa source select line or select gate source (SGS), and select gates 212 ₀to 212 ₃ might be commonly connected to a select line 215, such as adrain select line or select gate drain (SGD). Although depicted astraditional field-effect transistors, the select gates 210 and 212 mightutilize a structure similar to (e.g., the same as) the memory cells 208.The select gates 210 and 212 might represent a plurality of select gatesconnected in series, with each select gate in series configured toreceive a same or independent control signal.

A source of each select gate 210 might be connected to common source216. The drain of each select gate 210 might be connected to a memorycell 208 of the corresponding NAND string 206. For example, the drain ofselect gate 210 ₀ might be connected to memory cell 208 ₀₀ of thecorresponding NAND string 206 ₀. Therefore, each select gate 210 mightbe configured to selectively connect a corresponding NAND string 206 tocommon source 216. A control gate of each select gate 210 might beconnected to select line 214.

The drain of each select gate 212 might be connected to the data line204 for the corresponding NAND string 206. For example, the drain ofselect gate 212 ₀ might be connected to the data line 204 ₀ for thecorresponding NAND string 206 ₀. The source of each select gate 212might be connected to a memory cell 208 of the corresponding NAND string206. For example, the source of select gate 212 ₀ might be connected tomemory cell 208 ₀₃ of the corresponding NAND string 206 ₀. Therefore,each select gate 212 might be configured to selectively connect acorresponding NAND string 206 to the corresponding data line 204. Acontrol gate of each select gate 212 might be connected to select line215.

The memory array in FIG. 2A might be a quasi-two-dimensional memoryarray and might have a generally planar structure, e.g., where thecommon source 216, NAND strings 206 and data lines 204 extend insubstantially parallel planes. Alternatively, the memory array in FIG.2A might be a three-dimensional memory array, e.g., where NAND strings206 might extend substantially perpendicular to a plane containing thecommon source 216 and to a plane containing the data lines 204 thatmight be substantially parallel to the plane containing the commonsource 216.

A column of the memory cells 208 might be a NAND string 206 or aplurality of NAND strings 206 selectively connected to a given data line204. A row of the memory cells 208 might be memory cells 208 commonlyconnected to a given primary access line 202. A row of memory cells 208can, but need not, include all memory cells 208 commonly connected to agiven primary access line 202. Rows of memory cells 208 might often bedivided into one or more groups of physical pages of memory cells 208,and physical pages of memory cells 208 often include every other memorycell 208 commonly connected to a given primary access line 202. Forexample, memory cells 208 commonly connected to primary access line 202₃ and selectively connected to even data lines 204 (e.g., data lines 204₀ and 204 ₂) might be one physical page of memory cells 208 (e.g., evenmemory cells) while memory cells 208 commonly connected to primaryaccess line 202 ₃ and selectively connected to odd data lines 204 (e.g.,data lines 204 ₁ and 204 ₃) might be another physical page of memorycells 208 (e.g., odd memory cells). Other groupings of memory cells 208commonly connected to a given primary access line 202 might also definea physical page of memory cells 208. For certain memory devices, allmemory cells commonly connected to a given primary access line might bedeemed a physical page of memory cells. The portion of a physical pageof memory cells (which, in some embodiments, could still be the entirerow) that is read during a single read operation or programmed during asingle programming operation. A block of memory cells might includethose memory cells that are configured to be erased together, such asall memory cells connected to primary access lines 202 ₀-202 ₃ (e.g.,all NAND strings 206 sharing common primary access lines 202). Unlessexpressly distinguished, a reference to a page of memory cells hereinrefers to the memory cells of a logical page of memory cells. Althoughthe array of memory cells 200A depicts four primary access lines 202,four assist access lines 203, four data lines 204, and four memory cells208 in each NAND string 206, other lesser or greater numbers of suchelements might be used. Similarly, although a number of memory cells 208in a NAND string 206 would generally be equal to a number of primaryaccess lines 202 and to a number of assist access lines 203 in the arrayof memory cells 200A, a number of data lines 204 might be independent ofthe number of memory cells 208 in a NAND string 206, the number ofprimary access lines 202, and the number of assist access lines 203. Aprimary access line 202 and its corresponding assist access line 203might be referred to as an access line pair 205, access line pairs 205₀-205 ₃.

FIG. 2B is another schematic of a portion of an array of memory cells200B as could be used in a memory of the type described with referenceto FIG. 1, e.g., as a portion of array of memory cells 104. Likenumbered elements in FIG. 2B correspond to the description as providedwith respect to FIG. 2A. FIG. 2B provides additional detail of oneexample of a three-dimensional NAND memory array structure. Thethree-dimensional NAND memory array 200B might incorporate verticalstructures which might include semiconductor pillars where a portion ofa pillar might act as a channel region of both the primary memory cellportion and the assist memory cell portion of the split-gate memorycells of NAND strings 206.

The NAND strings 206 might be each selectively connected to a data line204 ₀-204 _(M) by a select transistor 212 (e.g., that might be drainselect transistors, commonly referred to as select gate drain) and to acommon source 216 by a select transistor 210 (e.g., that might be sourceselect transistors, commonly referred to as select gate source).Multiple NAND strings 206 might be selectively connected to the samedata line 204. Subsets of NAND strings 206 can be connected to theirrespective data lines 204 by biasing the select lines 215 ₀-215 _(K) toselectively activate particular select transistors 212 each between aNAND string 206 and a data line 204. The select transistors 210 can beactivated by biasing the select line 214. Each access line pair 205(e.g., a primary access line 202 and a corresponding assist access line203) might be connected to multiple rows of memory cells of the memoryarray 200B. Rows of split-gate memory cells that are commonly connectedto each other by a particular access line pair 205 might collectively bereferred to as tiers.

The three-dimensional NAND memory array 200B might be formed overperipheral circuitry 226. The peripheral circuitry 226 might represent avariety of circuitry for accessing the memory array 200B. The peripheralcircuitry 226 might include complementary circuit elements. For example,the peripheral circuitry 226 might include both n-channel and p-channeltransistors formed on a same semiconductor substrate, a process commonlyreferred to as CMOS, or complementary metal-oxide-semiconductors.Although CMOS often no longer utilizes a strictmetal-oxide-semiconductor construction due to advancements in integratedcircuit fabrication and design, the CMOS designation remains as a matterof convenience.

FIG. 2C is a further schematic of a portion of an array of memory cells200C as could be used in a memory of the type described with referenceto FIG. 1, e.g., as a portion of array of memory cells 104. Likenumbered elements in FIG. 2C correspond to the description as providedwith respect to FIG. 2A. Array of memory cells 200C may include stringsof series-connected split-gate memory cells (e.g., NAND strings) 206,access line pairs (e.g., word line pairs) 205, data (e.g., bit) lines204, select lines 214 (e.g., source select lines), select lines 215(e.g., drain select lines) and source 216 as depicted in FIG. 2A. Aportion of the array of memory cells 200A may be a portion of the arrayof memory cells 200C, for example. FIG. 2C depicts groupings of NANDstrings 206 into blocks of memory cells 250, e.g., blocks of memorycells 250 ₀-250 _(L). Blocks of memory cells 250 may be groupings ofmemory cells 208 that may be erased together in a single eraseoperation, sometimes referred to as erase blocks. Each block of memorycells 250 might include those NAND strings 206 commonly associated witha single select line 215, e.g., select line 215 o. The source 216 forthe block of memory cells 250 ₀ might be a same source as the source 216for the block of memory cells 250 _(L). For example, each block ofmemory cells 250 ₀-250 _(L) might be commonly selectively connected tothe source 216. Access line pairs 205 and select lines 214 and 215 ofone block of memory cells 250 may have no direct connection to accessline pairs 205 and select lines 214 and 215, respectively, of any otherblock of memory cells of the blocks of memory cells 250 ₀-250 _(L).

The data lines 204 ₀-204 _(M) may be connected (e.g., selectivelyconnected) to a buffer portion 230, which might be a portion of a databuffer of the memory. The buffer portion 230 might correspond to amemory plane (e.g., the set of blocks of memory cells 250 ₀-250 _(L) Thebuffer portion 230 might include sense circuits (not shown in FIG. 2C)for sensing data values indicated on respective data lines 204.

While the blocks of memory cells 250 of FIG. 2C depict only one selectline 215 per block of memory cells 250, the blocks of memory cells 250might include those NAND strings 206 commonly associated with more thanone select line 215. For example, select line 215 ₀ of block of memorycells 250 ₀ might correspond to the select line 215 ₀ of the memoryarray 200B of FIG. 2B, and the block of memory cells of the memory array200C of FIG. 2C might further include those NAND strings 206 associatedwith select lines 215 ₁-215 _(K) of FIG. 2B. In such blocks of memorycells 250 having NAND strings 206 associated with multiple select lines215, those NAND strings 206 commonly associated with a single selectline 215 might be referred to as a sub-block of memory cells. Each suchsub-block of memory cells might be selectively connected to the bufferportion 230 responsive to its respective select line 215.

FIG. 3A is a schematic of a split-gate memory cell 208 in accordancewith an embodiment. The memory cell 208 includes a primary memory cellportion 340 having its control gate 344 connected to (and is some cases,forming) a primary access line 202. The memory cell 208 further includesan assist memory cell portion 342 having its control gate 346 connectedto (and is some cases, forming) an assist access line 203.

The primary memory cell portion 340 includes a data-storage structure350 ₀ (e.g., a floating gate, charge trap, or other structure configuredto store charge) that can determine a data state of the primary memorycell portion 340 (e.g., through changes in threshold voltage). Thedata-storage structure 350 ₀ might include both conductive anddielectric structures while the control gate 344 is generally formed ofone or more conductive materials.

The assist memory cell portion 342 includes a data-storage structure 350₁ (e.g., a floating gate, charge trap, or other structure configured tostore charge) that can be used to adjust a threshold voltage of theassist memory cell portion 342. The data-storage structure 350 ₁ mightinclude both conductive and dielectric structures while the control gate346 is generally formed of one or more conductive materials. For someembodiments, the data-storage structure 350 ₀ and the data-storagestructure 350 ₁ might be isolated from one another. For otherembodiments, the data-storage structure 350 ₀ and the data-storagestructure 350 ₁ might be connected to one another, e.g., might be asingle data-storage structure. For example, data-storage structureshaving bulk dielectric properties, e.g., data-storage structuresfabricated solely with dielectric materials or fabricated withdiscontinuous instances of conductive materials (e.g., conductivenanodots or conductive crystals) contained within a continuousdielectric structure, might permit a single data-storage structure tostore independent levels of charge between the control gate 344 and thatdata-storage structure, and between the control gate 346 and thatdata-storage structure.

FIGS. 3B-3C plan views of split-gate memory cells 208 in accordance withembodiments. Like numbered elements in FIGS. 3B-3C correspond to thedescription as provided with respect to FIGS. 2A and 3A. FIGS. 3B-3Cprovide additional detail as to possible structures of the split-gatememory cells 208.

In the example of FIG. 3B, the memory cell 208 includes a primary memorycell portion 340 having its control gate 344 connected to (and is somecases, forming) a primary access line 202. The memory cell 208 furtherincludes an assist memory cell portion 342 having its control gate 346connected to (and is some cases, forming) an assist access line 203. Theprimary access line 202 and the assist access line 203 might be formedof one or more conductive materials. The primary access line 202 and theassist access line 203 might each comprise, consist of, or consistessentially of conductively doped polysilicon and/or might comprise,consist of, or consist essentially of metal, such as a refractory metal,or a metal-containing material, such as a refractory metal silicide or ametal nitride, e.g., a refractory metal nitride, as well as any otherconductive material.

The primary memory cell portion 340 and the assist memory cell portion342 might share a common charge-blocking structure 348. Thecharge-blocking structure 348 might contain a dielectric material. Thecharge-blocking structure 348 might comprise, consist of, or consistessentially of an oxide, e.g., silicon dioxide (SiO₂), and/or maycomprise, consist of, or consist essentially of a high-K dielectricmaterial, such as aluminum oxides (AlO_(x)), hafnium oxides (HfO_(x)),hafnium aluminum oxides (HfAlO_(x)), hafnium silicon oxides (HfSiO_(x)),lanthanum oxides (LaO_(x)), tantalum oxides (TaO_(x)), zirconium oxides(ZrO_(x)), zirconium aluminum oxides (ZrAlO_(x)), or yttrium oxide(Y₂O₃), as well as any other dielectric material. High-K dielectrics asused herein means a material having a dielectric constant greater thanthat of silicon dioxide.

The primary memory cell portion 340 and the assist memory cell portion342 might further share a common data-storage structure 350 (e.g., acharge trap, or other dielectric structure configured to store charge)that can determine a data state of the primary memory cell portion 340(e.g., through changes in threshold voltage) and that can be used toadjust a threshold voltage of the assist memory cell portion 342. Theprimary memory cell portion 340 and the assist memory cell portion 342might further share a common gate-dielectric structure 352. Thegate-dielectric structure 352 might contain a dielectric material suchas described with reference to the charge-blocking structure 348.

The primary memory cell portion 340 and the assist memory cell portion342 might further share a common semiconductor pillar 354. Thesemiconductor pillar 354 might be formed of a semiconductor material ofa particular conductivity type. As one example, the semiconductor pillar354 might be formed of a silicon-containing material, such as a P-typepolysilicon. Although the semiconductor pillar 354 is depicted in FIG.3B to have a solid core, the semiconductor pillar 354 could have anannular shape, e.g., a hollow core, similar to the shape of thegate-dielectric structure 352.

As depicted in FIG. 3B, the charge-blocking structure 348, data-storagestructure 350, gate-dielectric structure 352 and semiconductor pillar354 might extend a full length of a NAND string containing the memorycell 208. Alternatively, the charge-blocking structure 348, data-storagestructure 350, and gate-dielectric structure 352 for the memory cell 208of the NAND string might be isolated from the charge-blocking structure348, data-storage structure 350, and/or gate-dielectric structure 352for a different memory cell 208 of the NAND string, with only thesemiconductor pillar 354 extending the full length of the NAND string.

Isolation regions 356 might extend between the primary access line 202and the assist access line 203, e.g., to provide electrical isolation ofthe primary access line 202 from the assist access line 203. Theisolation regions 356 might contain a dielectric material such asdescribed with reference to the charge-blocking structure 348. Theisolation regions 356 might extend to an outer surface of thecharge-blocking structure 348 as depicted in FIG. 3B. The isolationregions 356 might further extend beyond the outer surface of thecharge-blocking structure 348.

In the example of FIG. 3C, the memory cell 208 includes a primary memorycell portion 340 having its control gate 344 connected to (and is somecases, forming) a primary access line 202. The memory cell 208 furtherincludes an assist memory cell portion 342 having its control gate 346connected to (and is some cases, forming) an assist access line 203. Theprimary access line 202 and the assist access line 203 might be formedof one or more conductive materials. The primary access line 202 and theassist access line 203 might each comprise, consist of, or consistessentially of conductively doped polysilicon and/or might comprise,consist of, or consist essentially of metal, such as a refractory metal,or a metal-containing material, such as a refractory metal silicide or ametal nitride, e.g., a refractory metal nitride, as well as any otherconductive material.

The primary memory cell portion 340 might include a charge-blockingstructure 348 ₀ and the assist memory cell portion 342 might include acharge-blocking structure 348 ₁. The charge-blocking structures 348,e.g., 348 ₀ and 348 ₁, might each contain a dielectric material. Thecharge-blocking structures 348 might comprise, consist of, or consistessentially of an oxide, e.g., silicon dioxide (SiO₂), and/or maycomprise, consist of, or consist essentially of a high-K dielectricmaterial, such as aluminum oxides (AlO_(x)), hafnium oxides (HfO_(x)),hafnium aluminum oxides (HfAlO_(x)), hafnium silicon oxides (HfSiO_(x)),lanthanum oxides (LaO_(x)), tantalum oxides (TaO_(x)), zirconium oxides(ZrO_(x)), zirconium aluminum oxides (ZrAlO_(x)), or yttrium oxide(Y₂O₃), as well as any other dielectric material. High-K dielectrics asused herein means a material having a dielectric constant greater thanthat of silicon dioxide.

The primary memory cell portion 340 might further include a data-storagestructure 350 ₀ and the assist memory cell portion 342 might include adata-storage structure 350 ₁. The data-storage structures 350, e.g., 350₀ and 350 ₁, might each include a floating gate, a charge trap, or otherstructure configured to store charge. The data-storage structure 350 ₀can determine a data state of the primary memory cell portion 340 (e.g.,through changes in threshold voltage) and the data-storage structure 350₁ can be used to adjust a threshold voltage of the assist memory cellportion 342. The primary memory cell portion 340 and the assist memorycell portion 342 might further share a common gate-dielectric structure352. The gate-dielectric structure 352 might contain a dielectricmaterial such as described with reference to the charge-blockingstructure 348.

The primary memory cell portion 340 and the assist memory cell portion342 might further share a common semiconductor pillar 354. Thesemiconductor pillar 354 might be formed of a semiconductor material ofa particular conductivity type. As one example, the semiconductor pillar354 might be formed of a silicon-containing material, such as a P-typepolysilicon. Although the semiconductor pillar 354 is depicted in FIG.3B to have a solid core, the semiconductor pillar 354 could have anannular shape, e.g., a hollow core, similar to the shape of thegate-dielectric structure 352.

As depicted in FIG. 3C, the charge-blocking structures 348 ₀ and 348 ₁,data-storage structures 350 ₀ and 350 ₁, gate-dielectric structure 352and semiconductor pillar 354 might extend a full length of a NAND stringcontaining the memory cell 208. Alternatively, the charge-blockingstructures 348 ₀ and 348 ₁, data-storage structures 350 ₀ and 350 ₁, andgate-dielectric structure 352 for the memory cell 208 of the NAND stringmight be isolated from the charge-blocking structures 348 ₀ and 348 ₁,data-storage structures 350 ₀ and 350 ₁, and/or gate-dielectricstructure 352 for a different memory cell 208 of the NAND string, withonly the semiconductor pillar 354 extending the full length of the NANDstring.

Isolation regions 356 might extend between the primary access line 202and the assist access line 203, e.g., to provide electrical isolation ofthe primary access line 202 from the assist access line 203. Theisolation regions 356 might contain a dielectric material such asdescribed with reference to the charge-blocking structure 348. Theisolation regions 356 might extend to an outer surface of thegate-dielectric structure 352 as depicted in FIG. 3C. The isolationregions 356 might further extend beyond the outer surface of thegate-dielectric structure 352, and might extend to be in contact withthe semiconductor pillar 354, thus dividing the gate-dielectricstructure 352 into two isolated structures.

FIG. 4 is a perspective view of an array structure in accordance with anembodiment. Like numbered elements in FIG. 4 correspond to thedescription as provided with respect to FIGS. 2A and 3A-3C. FIG. 4provides additional detail as to an array structure for the split-gatememory cells 208.

FIG. 4 depicts a portion of an array of memory cells 400, that mighthave a structure corresponding to the schematic of the portion of anarray of memory cells 200B of FIG. 2B. The primary access lines 202 _(X)and 202 _(X-1) and the assist access lines 203 _(X) and 203 _(X-1) mightcorrespond to any two adjacent primary access lines 202 ₀-202 _(N) andassist access lines 203 ₀-203 _(N), respectively, of FIG. 2B, where X isan integer value from 1 to N. For example, the primary access line 202_(X) and assist access line 203 _(X) of FIG. 4 might correspond to theprimary access line 202 ₁ and assist access line 203 ₁ of FIG. 2B,respectively, while the primary access line 202 _(X-1) and assist accessline 203 _(X-1) of FIG. 4 might correspond to the primary access line202 ₀ and assist access line 203 ₀ of FIG. 2B, respectively.

Each grouping of memory cells 460, e.g., groupings of memory cells 460₀-460 ₃, might correspond to columns of memory cells, each commonlyselectively connected to a same data line. For example, the grouping ofmemory cells 460 ₀ of FIG. 4 might depict portions of two NAND stringseach selectively connected to the data line 204 ₀ of FIG. 2B, thegrouping of memory cells 460 ₁ of FIG. 4 might depict portions of twoNAND strings each selectively connected to the data line 204 ₁ of FIG.2B, and so on.

Each grouping of memory cells 462, e.g., groupings of memory cells 462₀-462 ₁, might correspond to subarrays of memory cells, each selectivelyconnected to a respective data line in response to a same select line.For example, the grouping of memory cells 462 ₀ of FIG. 4 might depictportions of four NAND strings each selectively connected to a respectivedata line 204 of FIG. 2B in response to a control signal on the selectline 215 ₀, and the grouping of memory cells 462 ₁ of FIG. 4 mightdepict portions of four NAND strings each selectively connected to arespective data line 204 of FIG. 2B in response to a control signal onthe select line 215 ₁.

FIG. 4B is a plan view of an array structure of FIG. 4A in accordancewith an embodiment. FIG. 4B depicts an example of the electricalconnection of portions 464, e.g., portions 464 ₀-464 ₂, of the primaryaccess line 202 and the electrical connection of portions 466, e.g.,portions 466 ₀-466 ₁, of an assist access line 203. For example, theportions 464 might each be commonly connected to collectively form theprimary access line 202, and the portions 466 might each be commonlyconnected to collectively form the assist access line 203. The portions464 and the portions 466 are interleaved, and one portion 464 or portion466 might form a control gate for two groupings of memory cells 460, orcolumns of memory cells. For example, the portion 466 ₀ of the assistaccess line 203 might form a control gate for the assist memory cellportions of the grouping of memory cells 460 ₀ and of the grouping ofmemory cells 460 ₁. Similarly, the portion 4641 of the primary accessline 202 might form a control gate for the primary memory cell portionsof the grouping of memory cells 460 ₁ and of the grouping of memorycells 460 ₂. While three portions 464 and two portions 466 are depicted,the primary access line 202 and assist access line 203 might be formedof higher numbers of portions 464 and 466, respectively. A number X ofthe portions 464 and a number Y of the portions 466 might satisfy one ofthe following relationships: X equals Y, X is one less than Y, or X isone greater than Y.

FIG. 5 is a cross-sectional view of a portion of an array of split-gatememory cells in accordance with an embodiment. Three-dimensional memoryarrays are typically fabricated by forming alternating layers ofconductors and dielectrics, forming holes in these layers, formingadditional materials on sidewalls of the holes to define gate stacks formemory cells and other gates, e.g., select gates, and subsequentlyfilling the holes with a semiconductor material to define a pillarsection to act as channels of the memory cells and the gates. To improveconductivity of pillar sections and an adjacent semiconductor material,e.g., upon which they are formed, a conductive (e.g.,conductively-doped) portion is typically formed in the pillar section atan interface with the adjacent semiconductor material. These conductiveportions are typically formed of a different conductivity type than thepillar section and adjacent semiconductor material. For example, if thepillar section is formed of a P-type semiconductor material, theconductive portion might have an N-type conductivity.

Forming holes through multiple layers typically produces holes ofdecreasing diameter toward the bottom of the holes due to the nature ofthe removal processes commonly used in the semiconductor industry. Tomitigate against the holes becoming too narrow, formation of arrays ofthe type described with reference to FIGS. 2A-2C and 4, might besegmented, such that the layers for forming a first portion of the NANDstring might be formed, then portions might be removed to define holes,and the remaining structures might be formed within the holes. Followingformation of the first portion of the NAND string, a second portion ofthe NAND string might be formed over the first portion in a similarmanner. FIG. 5 depicts a structure of this type in accordance with anembodiment.

In FIG. 5, two strings of series-connected split-gate memory cells aredepicted in the cross-sectional view. It is noted that the spacesbetween various elements of the figure generally represent dielectricmaterial.

With reference to FIG. 5, a first NAND string might include a firstpillar section 554 ₀₀ and a second pillar section 554 ₁₀. The firstpillar section 554 ₀₀ and the second pillar section 554 ₀₀ might each beformed of a semiconductor material of a first conductivity type, such asa P-type polysilicon. Conductive portions 558 ₀₀ and 558 ₁₀ might beformed at the bottoms of the pillar sections 554 ₀₀ and 554 ₁₀,respectively, with the conductive portion 558 ₀₀ electrically connectedto the source 216 and the conductive portion 558 ₁₀ electricallyconnected to the pillar section 554 ₀₀. The conductive portions 558 ₀₀and 558 ₁₀ might be formed of a semiconductor material of a secondconductivity type different than the first conductivity type. For theexample where the first pillar section 554 ₀₀ and the second pillarsection 554 ₁₀ might each be formed of a P-type polysilicon, theconductive portions 558 ₀₀ and 558 ₁₀ might be formed of an N-typesemiconductor material, such as an N-type polysilicon. In addition, theconductive portions 558 ₀₀ and 558 ₁₀ might have a higher conductivitylevel than the pillar sections 554 ₀₀ and 554 ₁₀. For example, theconductive portions 558 ₀₀ and 558 ₁₀ might have an N+ conductivity.Alternatively, the conductive portions 558 ₀₀ and 558 ₁₀ might be formedof a conductor, e.g., a metal or metal silicide.

The pillar section 554 ₁₀ might be electrically connected to the dataline 204 through a conductive plug 560 ₀. The conductive plug 560 ₀, inthis example, might also be formed of a semiconductor material of thesecond conductivity type, and might likewise have a higher conductivitylevel than the pillar sections 554 ₀₀ and 554 ₁₀. Alternatively, theconductive plug 560 ₀ might be formed of a conductor, e.g., a metal ormetal silicide. The first NAND string might further include a sourceselect gate at an intersection of the source select line 214 and thepillar section 554 ₀₀, and a drain select gate at an intersection of thedrain select line 215 and the pillar section 554 ₁₀. The first NANDstring might further include a split-gate memory cell at an intersectionof each of the pillar sections 554 ₀₀ and 554 ₁₀, and the primary accesslines 202 ₀-202 ₇ and assist access lines 203 ₀-203 ₇. These split-gatememory cells might further include data-storage structures 350 ₀₀-350₇₀. While the structure of FIG. 5 is depicted to include only eightprimary access lines 202 and eight assist access lines 203 for each NANDstring in an effort to improve readability of the figure, NANDstructures in accordance with embodiments might have significantly moreprimary access lines 202 and assist access lines 203.

Although not all numbered, for clarity of FIG. 5, data-storagestructures 350 are depicted on both sides of the pillar sections 554.Individual data-storage structures 350 might wrap completely aroundtheir respective pillar section 554, such as depicted in the example ofFIG. 3B. Alternatively, a first portion of a data-storage structure 350between its respective pillar section 554 and its respective primaryaccess line 202 might be isolated from a second portion of thatdata-storage structure 350 between its respective pillar section 554 andits respective assist access line 203, such as depicted in the exampleof FIG. 3C.

To improve the conductivity across the conductive portion 558 ₁₀, thefirst NAND string might further include an intermediate gate at anintersection of the select line 217. This divides the split-gate memorycells of the first NAND string into a first deck of split-gate memorycells 556 ₀ and a second deck of split-gate memory cells 556 ₁. Althoughdepicted as a traditional field-effect transistor, the intermediate gateformed at the intersection of a pillar section 554 ₁₀ with the selectline 217 might utilize a data-storage structure 350, along with agate-dielectric structure and charge-blocking structure, similar to thememory cells formed at intersections of primary access lines 202 andassist access lines 203 with the pillar section 554 ₁₀.

The decks of split-gate memory cells 556 can generally be thought of asgroupings of split-gate memory cells sharing a common pillar section554, i.e., a single pillar section 554 acting as channel regions forthat grouping of split-gate memory cells, and can be extended to includea plurality of groupings of split-gate memory cells, where each suchgrouping of split-gate memory cells shares a common pillar section 554,and the respective common pillar sections 554 are formed at the samelevel (e.g., are intersected by the same primary access lines 202),which might include all such groupings of split-gate memory cellssharing a common set (e.g., one or more) of primary access lines 202.For example, deck of split-gate memory cells 556 ₀ might include thosesplit-gate memory cells formed at the intersections of primary accesslines 202 ₀-202 ₃, and assist access lines 203 ₀-203 ₃, with the pillarsection 554 ₀₀. The deck of split-gate memory cells 556 ₀ might furtherinclude those split-gate memory cells formed at the intersections ofprimary access lines 202 ₀-202 ₃, and assist access lines 203 ₀-203 ₃,with their respective pillar sections 554 ₀₀ and 554 ₀₁, and might stillfurther include all split-gate memory cells formed at the intersectionsof primary access lines 202 ₀-202 ₃, and assist access lines 203 ₀-203₃, with the pillar sections 554 ₀₀ and 554 ₀₁, and with any other pillarsections 554 formed at the same level.

The channel regions for the primary memory cell portions of thesplit-gate memory cells of a grouping of split-gate memory cells are incommunication with the channel regions for the assist memory cellportions of the split-gate memory cells of that grouping of memorycells. That is, a continuous conductive path can be established if atleast one of the memory cell portions of each split-gate memory cell isactivated. For example, a conductive path through the pillar section 554₀₀ could be established by biasing the assist access lines 203 ₀, 203 ₁and 203 ₃ to activate the corresponding assist memory cell portions, andby biasing the primary access line 203 ₂ to activate its correspondingprimary memory cell portion.

With further reference to FIG. 5, a second NAND string might include thefirst pillar section 554 ₀₁ and a second pillar section 554 ₁₁. Thefirst pillar section 554 ₀₁ and a second pillar section 554 ₁₁ mighteach be formed of a semiconductor material of the first conductivitytype, such as a P-type polysilicon. Conductive portions 558 ₀₁ and 558₁₁ might be formed at the bottoms of the pillar sections 554 ₀₁ and 554₁₁, respectively, with the conductive portion 558 ₀₁ electricallyconnected to the source 216 and the conductive portion 558 ₁₁electrically connected to the pillar section 554 ₀₁. The conductiveportions 558 ₀₁ and 558 ₁₁ might be formed of a semiconductor materialof the second conductivity type. For the example where the first pillarsection 554 ₀₁ and a second pillar section 554 ₁₁ might each be formedof a P-type polysilicon, the conductive portions 558 ₀₁ and 558 ₁₁ mightbe formed of an N-type semiconductor material, such as an N-typepolysilicon. In addition, the conductive portions 558 ₀₁ and 558 ₁₁might have a higher conductivity level than the pillar sections 554 ₀₁and 554 ₁₁. For example, the conductive portions 558 ₀₁ and 558 ₁₁ mighthave an N+ conductivity.

The pillar section 554 ₁₁ might be electrically connected to the dataline 204 through a conductive plug 560 ₁. The conductive plug 560 ₁, inthis example, might also be formed of a semiconductor material of thesecond conductivity type, and might likewise have a higher conductivitylevel than the pillar sections 554 ₀₁ and 554 ₁₁. Alternatively, theconductive plug 560 ₁ might be formed of a conductor, e.g., a metal ormetal silicide. The second NAND string might further include a sourceselect gate at an intersection of the source select line 214 and thepillar section 554 ₀₁, and a drain select gate at an intersection of thedrain select line 215 and the pillar section 554 ₁₁. The second NANDstring might further include a split-gate memory cell at an intersectionof each of the pillar sections 554 ₀₁ and 554 ₁₁, and the primary accesslines 202 ₀-202 ₇ and assist access lines 203 ₀-203 ₇. These split-gatememory cells might further include data-storage structures 350 ₀₁-350₇₁, which might have structures as described with reference to thedata-storage structures 350 ₀₀-350 ₇₀.

To improve the conductivity across the conductive portion 558 ₁₁, thesecond NAND string might further include an intermediate gate at anintersection of the select line 217 and the pillar section 554 ₁₁. Thisdivides the split-gate memory cells of the second NAND string into thefirst deck of split-gate memory cells 556 ₀ and the second deck ofsplit-gate memory cells 556 ₁. While only two decks of split-gate memorycells 556 are depicted in FIG. 5, fewer or more decks of split-gatememory cells 556 might be utilized in a NAND string in accordance withembodiments. In addition, although depicted as a traditionalfield-effect transistor, the intermediate gate formed at theintersection of a pillar section 554 ₁₁ with the select line 217 mightutilize a data-storage structure 350, along with a gate-dielectricstructure and charge-blocking structure, similar to the memory cellsformed at intersections of primary access lines 202 and assist accesslines 203 with the pillar section 554 ₁₁.

FIG. 6 is a schematic of a portion of an array of memory cells andstring drivers as could be used in a memory device of the type describedwith reference to FIG. 1 and depicting a many-to-one relationshipbetween local primary access lines (e.g., local primary word lines) 202and global primary access lines (e.g., global primary word lines) 602,and a many-to-one relationship between local assist access lines (e.g.,local assist word lines) 203 and global assist access lines (e.g.,global assist word lines) 603.

As depicted in FIG. 6, a plurality of blocks of memory cells 250 mighthave their local primary access lines (e.g., local primary word lines)202 commonly selectively connected to a plurality of global primaryaccess lines (e.g., global primary word lines) 602, and might have theirlocal assist access lines (e.g., local assist word lines) 203 commonlyselectively connected to a plurality of global assist access lines(e.g., global assist word lines) 603. Although FIG. 6 depicts onlyblocks of memory cells 250 ₀ and 250 _(L) (Block 0 and Block L),additional blocks of memory cells 250 might have their local primaryaccess lines 202 commonly connected to global primary access lines 602in a like manner, and might have their local assist access lines 203commonly connected to global assist access lines 603 in a like manner.Similarly, although FIG. 6 depicts only four local primary access lines202 and four local assist access lines 203, blocks of memory cells 250might include fewer or more local primary access lines 202 and localassist access lines 203. The blocks of memory cells 250 ₀-250 _(L) mightbelong to a single plane of memory cells 242.

To facilitate memory access operations to specific blocks of memorycells 250 commonly coupled to a given set of global primary access lines602 and a given set of global assist access lines 603, each block ofmemory cells 250 might have a corresponding set of block selecttransistors 662 in a one-to-one relationship with their local primaryaccess lines 202 and a corresponding set of block select transistors 664in a one-to-one relationship with their local assist access lines 203.Control gates of the set of block select transistors 662 and the set ofblock select transistor 664 for a given block of memory cells 250 mighthave their control gates commonly connected to a corresponding blockselect line 668. For example, for block of memory cells 250 ₀, localprimary access line 202 ₀₀ might be selectively connected to globalprimary access line 602 ₀ through block select transistor 662 ₀₀, localassist access line 203 ₀₀ might be selectively connected to globalassist access line 603 ₀ through block select transistor 664 ₀₀, localprimary access line 202 ₁₀ might be selectively connected to globalprimary access line 602 ₁ through block select transistor 662 ₁₀, localassist access line 203 ₁₀ might be selectively connected to globalassist access line 603 ₁ through block select transistor 664 ₁₀, localprimary access line 202 ₂₀ might be selectively connected to globalprimary access line 602 ₂ through block select transistor 662 ₂₀, localassist access line 203 ₂₀ might be selectively connected to globalassist access line 603 ₂ through block select transistor 664 ₂₀, localprimary access line 202 ₃₀ might be selectively connected to globalprimary access line 602 ₃ through block select transistor 662 ₃₀, andlocal assist access line 203 ₃₀ might be selectively connected to globalassist access line 603 ₃ through block select transistor 664 ₃₀, whileblock select transistors 662 ₀₀-662 ₃₀ and block select transistors 664₀₀-664 ₃₀ are responsive to a control signal received on block selectline 668 ₀. The block select transistors 662 and block selecttransistors 664 for a block of memory cells 250 might collectively bereferred to as a string driver, or simply driver circuitry.

FIGS. 7A-7B are conceptual depictions of threshold voltage distributionsof a plurality of memory cells for use with embodiments. FIG. 7Aillustrates an example of a threshold voltage range and its thresholdvoltage distribution 770 for a plurality of memory cells following anerase operation on those memory cells. For example, charge might beremoved from the data-storage structures of those memory cells to placethem in an initial data state, e.g., an erased data state. FIG. 7Billustrates an example of threshold voltage ranges and theirdistributions for what might be referred to as single-level memorycells, often referred to as SLC. A memory cell programmed as SLC mightstore one of two data states, e.g., a logical 1 or a logical 0 datastate. For example, the threshold voltage distribution 772 mightrepresent a logical 1 data state, and the threshold voltage distribution774 might represent a logical 0 data state.

In programming SLC memory, memory cells intended to have a thresholdvoltage within the threshold voltage distribution 772 might be inhibitedfrom programming, such that they might maintain the threshold voltagethat they had in the threshold voltage distribution 770 of FIG. 7A.Memory cells intended to have a threshold voltage within the thresholdvoltage distribution 774 might be enabled for programming in order toshift (e.g., increase) their threshold voltage. Typically, suchprogramming would involve the application of a programming pulse to thecontrol gate of a memory cell, followed by a verify operation todetermine whether that memory cell has reached a desired thresholdvoltage. Typical programming operations use many programming pulses inan incremental step pulse programming scheme, where each programmingpulse is a single pulse that moves the memory cell threshold voltage bysome amount, and each subsequent programming pulse is higher than apreceding programming pulse. For the verify operation, a verify voltageVvfy might be applied to the control gate of that memory cell todetermine whether the memory cell remains deactivated. If the memorycell remains deactivated in response to the verify voltage Vvfy,programming might be deemed to be complete for that memory cell. If thememory cell is activated in response to the verify voltage Vvfy, anadditional, higher, programming pulse might be applied to the controlgate of that memory cell while it is enabled for programming. Thisprocess of program/verify might be repeated until each memory cellselected for programming has reached its desired data state.

To sense the data state of a memory cell (e.g., selected memory cell) ofa string of series-connected memory cells, that memory cell mightreceive the verify voltage Vvfy at its control gate for a verifyoperation or a read voltage Vread at its control gate for a readoperation. The verify voltage Vvfy is typically higher than the readvoltage Vread to improve reliability of the subsequent read operation.During either a verify operation or a read operation, remaining memorycells (e.g., unselected memory cells) of that string of series-connectedmemory cells might receive a pass voltage Vpass applied to their controlgates that is expected to activate those memory cell regardless of theirdata state. In this manner, the ability of the string ofseries-connected memory cells to pass current can be used to indicatewhether the selected memory cell is activated or deactivated.

During a programming operation, some memory cells might become overprogrammed, which might be indicated by the threshold voltagedistribution 776. This might occur if the voltage level differencebetween one programming pulse and an immediately subsequent programmingpulse is too high for the programming speed of the memory cells. Aprogramming speed of a memory cell might be unexpectedly fast due toanomalies in the fabrication process or materials, for example. Whilesmaller incremental steps between programming pulses can reduce the riskof over programming, this also generally increases the time and powerrequirements to complete the programming operation.

Memory cells of the threshold voltage distribution 776 having thresholdvoltages higher than the pass voltage Vpass would remain deactivated inresponse to the pass voltage Vpass applied to their control gates. Assuch, during a sense operation (e.g., verify operation or readoperation), a string of series-connected memory cells containingunselected memory cells having threshold voltages higher than the passvoltage Vpass would indicate the selected memory cell as beingdeactivated regardless of whether it was activated in response to theread voltage Vread applied to its control gate. This can lead to dataerrors. Various embodiments provide an array structure and mechanism tomitigate such errors. Various embodiments might further facilitatedecreases in programming time and decreases in power requirements tocomplete a programming operation.

For example, the assist memory cell portions of a string ofseries-connected split-gate memory cells might each be programmed to acontrolled range of threshold voltages. This programming might beperformed prior to installing the memory into an electronic system. Itwould be expected that such programming of the assist memory cellportions might be performed only rarely, and perhaps only once during anexpected life of the memory. With the assist memory cell portions havinga controlled range of threshold voltages, over programming of theprimary memory cell portions may become moot. In particular, becauseactivation of only one memory cell portion of a split-gate memory cellcan provide a current path through the split-gate memory cell, a primarymemory cell portion of an unselected split-gate memory cell deactivatedin response to a pass voltage during a read operation of a selectedsplit-gate memory cell would not affect the sensed data state of theselected split-gate memory cell provided the assist memory cell portionof the unselected split-gate memory cell is activated. As such,programming of a primary memory cell portion might be performed with asingle programming pulse having a voltage level sufficient to increaseits threshold voltage beyond the verify voltage. Such a voltage levelmight be determined during characterization of the memory duringfabrication and testing. This voltage level might represent the minimumvoltage level determined to sufficiently increases the threshold voltageof each memory cell of the memory. Alternatively, respective voltagelevels might be determined for smaller groupings of memory cells, suchas blocks of memory cells, or pages of memory cells.

To prepare a memory in accordance with an embodiment, both the primarymemory cell portion and the assist memory cell portion of the split-gatememory cells might be erased. Table 1 provides an example of voltagelevels that might be applied to a string of series-connected split-gatememory cells during an erase operation of both the primary memory cellportions and the assist memory cell portions.

TABLE 1 Node Voltage Level Data Line 204 20 V Primary Access Lines 202 0 V Assist Access Lines 203  0 V Source 216 20 V

Other voltage levels could be used to erase the split-gate memory cells.In general, a voltage differential is applied between the control gatesof the split-gate memory cell and the channel regions of the split-gatememory cells configured to remove charge from the data-storage nodes ofthe primary memory cell portions and the assist memory cell portions.Although not listed in Table 1, select gates, e.g., select gates 210 and212, might be activated during the erase operation. It is noted that theerase operation might be iterative, with increasing erase voltagesapplied to the data line and source. An erase verify operation might beperformed between erase voltages.

Following erasure of the split-gate memory cells, the assist memory cellportions might be programmed to a controlled range of thresholdvoltages. Programming the assist memory cell portions might include aniterative process of applying a programming pulse to an assist memorycell portion and verifying if that assist memory cell portion hasreached its a target threshold voltage in response to that programmingpulse, and repeating that iterative process until that assist memorycell portion passes the verification. Once an assist memory cell portionpasses the verification, it may be inhibited from further programming,although other assist memory cell portions may still be enabled forprogramming for subsequent programming pulses. The iterative process canbe repeated with changing (e.g., increasing) voltage levels of theprogramming pulse until each assist memory cell portion selected for theprogramming operation has reached the target threshold voltage, or untilsome failure is declared, e.g., reaching a maximum number of allowedprogramming pulses during the programming operation. Table 2 provides anexample of voltage levels that might be applied to a string ofseries-connected split-gate memory cells during a programming operationof an assist memory cell portion of a selected split-gate memory cell.

TABLE 2 Voltage Level Node Enabled Inhibited Data Line 204 0 V VccPrimary Access Lines 202 10 V Selected Assist Access Line 203 15-20 VUnselected Assist Access Lines 203 10 V

Other voltage levels could be used to program an assist memory cellportion of a split-gate memory cell. Although not listed in Table 2,source select gates, e.g., select gates 210, might be deactivated duringthe programming operation, while drain select gates, e.g., select gates212, might be activated for enabled split-gate memory cells anddeactivated for inhibited split-gate memory cells. In general, a voltagedifferential is applied between the control gate of the assist memorycell portion of the selected split-gate memory cell and the channelregion of the selected split-gate memory cell configured to add chargeto the data storage node of the assist memory cell portion of theselected split-gate memory cell. The primary memory cell portions andthe unselected assist memory cell portions might receive a voltage levelat their control gates configured to activate those memory cell portionsand to inhibit programming of those memory cell portions. Theprogramming operation might be performed concurrently for the assistmemory cell portion of each split-gate memory cell connected to theselected assist access line and selectively connected to a respectivedata line in response to a control signal on a same select line 215. Inresponse to an assist memory cell portion reaching the target thresholdvoltage, the respective data line selectively connected to that assistmemory cell portion might be increased to a voltage level, e.g., aninhibit voltage, configured to deactivate its corresponding drain selectgate 212, such that channel regions of inhibited strings ofseries-connected memory cells would become electrically floating. Theresulting threshold voltage distribution of the assist memory cellportions might correspond to the threshold voltage distribution 774 ofFIG. 7B. Selection of a voltage difference between adjacent programmingpulses can be used to control a width of the threshold voltagedistribution in manners understood in the art. In this manner, thecontrolled range of threshold voltages of the assist memory cellportions might be higher than the verify voltage level, and lower thanthe pass voltage of a read operation of the memory.

As noted previously, a verify operation might be performed betweenprogramming pulses. Table 3 provides an example of voltage levels thatmight be applied to a string of series-connected split-gate memory cellsduring a verify operation of an assist memory cell portion of a selectedsplit-gate memory cell.

TABLE 3 Node Voltage Level Data Line 204 Vcc Primary Access Lines 202 −3V Selected Assist Access Line 203 0.5 V Unselected Assist Access Lines203 5 V Source 216 0 V

Other voltage levels could be used to verify an assist memory cellportion of a split-gate memory cell. In general, the verify voltagelevel, e.g., 0.5V in this example, might be applied to the control gateof the assist memory cell portion of the selected split-gate memorycell. For the remaining unselected split-gate memory cells, the controlgates of their assist memory cell portions might receive a voltagelevel, e.g., a pass voltage, sufficient to activate those assist memorycell portions if they had threshold voltages within the controlled rangeof threshold voltages. Note that some of the assist memory cell portionsof the unselected split-gate memory cells might still be in an erasedstate if their programming has not been performed. However, such assistmemory cell portions would still be activated in response to the passvoltage. During the verify operation, the control gates of the primarymemory cell portions of each split-gate memory cell of the string ofseries-connected split-gate memory cells might receive a voltage levelsufficient to deactivate those primary memory cell portions having athreshold voltage corresponding to the erased state. If current flow isdetected through the assist memory cell portion of the selectedsplit-gate memory cell, such as through a voltage drop on the data line,the assist memory cell portion might be deemed to fail the verifyoperation and be enabled for programming during a subsequent programmingpulse. If current flow is not detected through the assist memory cellportion of the selected split-gate memory cell, the assist memory cellportion might be deemed to pass the verify operation and be inhibitedfrom programming during a subsequent programming pulse.

The programming of the assist memory cell portions might be performed bya fabricator of the memory. A desire to reprogram the assist memory cellportions might be evaluated autonomously by the memory, e.g., inresponse to a number of program/erase cycles of the primary memory cellportions of the split-gate memory cells, or in response to an event,such as a number of bit errors exceeding a threshold. For example, abackground verify operation could be performed to determine if any ofthe assist memory cell portions have experienced charge loss, such thattheir threshold voltages are lower than the verify voltage level. Suchassist memory cell portions could then be reprogrammed as discussed withreference to Table 2. This operation might be performed when the memoryis idle, such that it could be invisible to a user of the memory. Notethat no erase operation is necessary prior to reprogramming as the goalis simply to increase the threshold voltage from its current level backinto the controlled range of threshold voltages.

With the assist memory cell portions programmed to have thresholdvoltage levels within their desired controlled range of thresholdvoltages, user data can be programmed into the primary memory cellportions of the split-gate memory cells. While programming of theprimary memory cell portions can involve an iterative process like theassist memory cell portions, various embodiments have been disclosed tomitigate errors resulting from over-programming. As such, programming ofthe primary memory cell portions as SLC memory might include applying asingle programming pulse to a primary memory cell portion having avoltage level deemed sufficient to increase its threshold voltage abovea read voltage of a read operation of the memory. Such a voltage levelcan be determined during characterization of the memory. A verifyoperation might not be performed. Although such advantages might beunavailable if there is a desire to store data to the primary memorycell portions at higher memory densities, e.g., MLC, TLC, QLC, etc.,various embodiments might still mitigate errors resulting fromover-programmed primary memory cell portions. Table 4 provides anexample of voltage levels that might be applied to a string ofseries-connected split-gate memory cells during a programming operationof a primary memory cell portion of a selected split-gate memory cell.

TABLE 4 Voltage Level Node Enabled Inhibited Data Line 204 0 V VccSelected Primary Access Line 202 20 V Unselected Primary Access Lines202 10 V Assist Access Lines 203 10 V

Other voltage levels could be used to program a primary memory cellportion of a split-gate memory cell. Although not listed in Table 4,source select gates, e.g., select gates 210, might be deactivated duringthe programming operation, while drain select gates, e.g., select gates212 might be activated for enabled split-gate memory cells anddeactivated for inhibited split-gate memory cells. In general, a voltagedifferential is applied between the control gate of the primary memorycell portion of the selected split-gate memory cell and the channelregion of the selected split-gate memory cell configured to add chargeto the data storage node of the primary memory cell portion of theselected split-gate memory cell. The assist memory cell portions and theunselected primary memory cell portions might receive a voltage level attheir control gates configured to activate those memory cell portionsand to inhibit programming of those memory cell portions. Theprogramming operation might be performed concurrently for the primarymemory cell portion of each split-gate memory cell connected to theselected primary access line and selectively connected to a respectivedata line in response to a control signal on a same select line 215. Theresulting threshold voltage distribution of the primary memory cellportions might correspond to the threshold voltage distribution 776 ofFIG. 7B.

Following programming of a primary memory cell portion, a read operationmight be performed. Table 5 provides an example of voltage levels thatmight be applied to a string of series-connected split-gate memory cellsduring a read operation of a primary memory cell portion of a selectedsplit-gate memory cell.

TABLE 5 Node Voltage Level Data Line 204 Vcc Selected Primary AccessLine 202 0 V Unselected Primary Access Lines 202 5 V Selected AssistAccess Line 203 0 V Unselected Assist Access Lines 203 5 V Source 216 0V

Other voltage levels could be used to verify an assist memory cellportion of a split-gate memory cell. Although not listed in Table 5,select gates, e.g., select gates 210 and 212, might be activated duringthe read operation. In general, a read voltage level, e.g., 0V in thisexample, might be applied to the control gate of the primary memory cellportion of the selected split-gate memory cell to selectively activatethat primary memory cell portion depending upon its data state. Thecontrol gate of the assist memory cell portion of the selectedsplit-gate memory cell might receive a voltage level configured todeactivate that assist memory cell portion. For the remaining unselectedsplit-gate memory cells, the control gates of their assist memory cellportions might receive a voltage level, e.g., a pass voltage, sufficientto activate those assist memory cell portions if they had thresholdvoltages within the controlled range of threshold voltages. Although notnecessary, the control gates of the primary memory cell portions of theunselected split-gate memory cells might also receive the pass voltageexpected to activate those primary memory cell portions regardless oftheir data states. For some embodiments, the unselected primary accesslines 202 might receive 0V, which might reduce energy requirementsduring the read operation.

The data state of the selected split-gate memory cell might bedetermined by sensing current flow through the primary memory cellportion of the selected split-gate memory cell. If current flow isdetected through the primary memory cell portion of the selectedsplit-gate memory cell, such as through a voltage drop on the data line,the selected split-gate memory cell might be deemed to have a first datastate, e.g., an erased data state or a logic 1. If current flow is notdetected through the primary memory cell portion of the selectedsplit-gate memory cell, the selected split-gate memory cell might bedeemed to have a second data state, e.g., a programmed data state or alogic 0.

Erasing primary memory cell portions might be performed without erasingthe assist memory cell portions. Table 6 provides an example of voltagelevels that might be applied to a string of series-connected split-gatememory cells during an erase operation of the primary memory cellportions.

TABLE 6 Node Voltage Level Data Line 204 20 V Primary Access Lines 202 0 V Assist Access Lines 203 floating Source 216 20 V

Other voltage levels could be used to erase the primary memory cellportions of the split-gate memory cells. In general, a voltagedifferential is applied between the control gates of the primary memorycell portions of the split-gate memory cell and the channel regions ofthe split-gate memory cells configured to remove charge from thedata-storage nodes of the primary memory cell portions. Electricallyfloating the assist access lines allows them to follow the voltage levelof the channel regions through capacitive coupling, thus inhibitingerasure of the assist memory cell portions. Although not listed in Table6, select gates, e.g., select gates 210 and 212, might be activatedduring the erase operation. It is noted that the erase operation mightbe iterative, with increasing erase voltages applied to the data lineand source. An erase verify operation might be performed between erasevoltages.

FIG. 8 depicts a flowchart of a method of operating a memory accordingto an embodiment, e.g., during an erase operation in accordance with anembodiment. The method might be in the form of computer-readableinstructions, e.g., stored to the instruction registers 128. Suchcomputer-readable instructions might be executed by a controller, e.g.,the control logic 116, to cause the memory (e.g., relevant components ofthe memory) to perform the method.

At 801, each primary access line of a plurality of primary access linesmight be actively biased while applying an erase voltage to each stringof series-connected split-gate memory cells of a plurality of strings ofseries-connected split-gate memory cells. The bias level for aparticular primary access line of the plurality of primary access linesmight be a voltage level configured to remove charge from a data-storagestructure of each primary memory cell portion connected to theparticular primary access line. Different voltage levels could beapplied to different primary access lines of the plurality of primaryaccess lines. For example, in an array structure similar to that of FIG.5, but having more than two decks, different channel voltages mightresult in different pillar sections, such that primary access lines fordifferent decks might receive different voltage levels to providesimilar (e.g., same) voltage differentials.

At 803, each assist access line of a plurality of assist access linesmight be electrically floated while applying the erase voltage to eachstring of series-connected split-gate memory cells of the plurality ofstrings of series-connected split-gate memory cells. Assist memory cellportions of the plurality of strings of series-connected split-gatememory cells might each have a positive threshold voltage. Primarymemory cell portions of the plurality of strings of series-connectedsplit-gate memory cells might positive or negative threshold voltages.

FIG. 9 depicts a flowchart of a method of operating a memory accordingto an embodiment, e.g., during a read operation in accordance with anembodiment. The method might be in the form of computer-readableinstructions, e.g., stored to the instruction registers 128. Suchcomputer-readable instructions might be executed by a controller, e.g.,the control logic 116, to cause the memory (e.g., relevant components ofthe memory) to perform the method.

At 911, a first voltage level might be applied to a selected primaryaccess line of a plurality of primary access lines that is connected toa control gate of a primary memory cell portion of a selected split-gatememory cell, wherein the first voltage level is configured toselectively activate the primary memory cell portion of the selectedsplit-gate memory cell depending upon its data state.

At 913, a second voltage level might be applied to a selected assistaccess line of a plurality of assist access lines that is connected to acontrol gate of an assist memory cell portion of the selected split-gatememory cell, wherein the second voltage level is configured todeactivate the assist memory cell portion of the selected split-gatememory cell.

At 915, a third voltage level might be applied to an unselected assistaccess line of the plurality of assist access lines that is connected toa control gate of an assist memory cell portion of an unselectedsplit-gate memory cell of the read operation, wherein the third voltagelevel is configured to activate the assist memory cell portion of theunselected split-gate memory cell. The third voltage level might beapplied to each assist access line of the plurality of assist accesslines other than the selected assist access line. The third voltagelevel might further be applied to an unselected primary access line ofthe plurality of primary access lines that is connected to the controlgate of the primary memory cell portion of the unselected split-gatememory cell, wherein the third voltage level is configured to activatethe primary memory cell portion of the unselected split-gate memorycell. The third voltage level might further be applied to each primaryaccess line of the plurality of primary access lines other than theselected primary access line.

CONCLUSION

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe embodiments will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the embodiments.

What is claimed is:
 1. A memory, comprising: an array of memory cellscomprising a plurality of strings of series-connected split-gate memorycells, wherein each split-gate memory cell of the plurality of stringsof series-connected split-gate memory cells comprises a primary memorycell portion and an assist memory cell portion, and wherein, for eachsplit-gate memory cell of the plurality of strings of series-connectedsplit-gate memory cells, the primary memory cell portion of thatsplit-gate memory cell is configured to store a data state that isaccessible through a read operation during normal operation of thememory and a data state of the assist memory cell portion of thatsplit-gate memory cell is configured to be inaccessible through the readoperation during normal operation of the memory; a plurality of primaryaccess lines, wherein each primary access line of the plurality ofprimary access lines is connected to a control gate of the primarymemory cell portion of a respective split-gate memory cell of eachstring of series-connected split-gate memory cells of the plurality ofstrings of series-connected split-gate memory cells; and a plurality ofassist access lines, wherein each assist access line of the plurality ofassist access lines is connected to a control gate of the assist memorycell portion of its respective split-gate memory cell of each string ofseries-connected split-gate memory cells of the plurality of strings ofseries-connected split-gate memory cells.
 2. The memory of claim 1,wherein, for each split-gate memory cell of the plurality of strings ofseries-connected split-gate memory cells, the primary memory cellportion of that split-gate memory cell is configured for output of datausing a read operation of the memory, and a data state of the assistmemory cell portion of that split-gate memory cell is configured to beinaccessible using the read operation.
 3. The memory of claim 1, furthercomprising: a plurality of data lines, wherein each data line of theplurality of data lines is selectively connected to a respective stringof series-connected split-gate memory cell of the plurality of stringsof series-connected split-gate memory cells; and a common source,wherein each string of series-connected split-gate memory cells of theplurality of strings of series-connected split-gate memory cells isselectively connected to the common source.
 4. The memory of claim 3,wherein the plurality of strings of series-connected split-gate memorycells is a first plurality of strings of series-connected split-gatememory cells, and wherein the array of memory cells further comprises: asecond plurality of strings of series-connected split-gate memory cells,wherein each split-gate memory cell of the second plurality of stringsof series-connected split-gate memory cells comprises a primary memorycell portion and an assist memory cell portion; wherein each data lineof the plurality of data lines is further selectively connected to arespective string of series-connected split-gate memory cell of thesecond plurality of strings of series-connected split-gate memory cells;and wherein each string of series-connected split-gate memory cells ofthe second plurality of strings of series-connected split-gate memorycells is selectively connected to the common source.
 5. The memory ofclaim 4, wherein each primary access line of the plurality of primaryaccess lines is further connected to a control gate of the primarymemory cell portion of a respective split-gate memory cell of eachstring of series-connected split-gate memory cells of the secondplurality of strings of series-connected split-gate memory cells, andwherein each assist access line of the plurality of assist access linesis connected to a control gate of the assist memory cell portion of itsrespective split-gate memory cell of each string of series-connectedsplit-gate memory cells of the second plurality of strings ofseries-connected split-gate memory cells.
 6. The memory of claim 1,wherein, for each split-gate memory cell of the plurality of strings ofseries-connected split-gate memory cells, the primary memory cellportion of that split-gate memory cell comprises a data-storagestructure, and the assist memory cell portion of that split-gate memorycell comprises a data-storage structure.
 7. The memory of claim 6,wherein, for each split-gate memory cell of the plurality of strings ofseries-connected split-gate memory cells, the data-storage structure ofthe primary memory cell portion of that split-gate memory cell and thedata-storage structure of the assist memory cell portion of thatsplit-gate memory cell comprise a continuous dielectric structure. 8.The memory of claim 6, wherein, for each split-gate memory cell of theplurality of strings of series-connected split-gate memory cells, thedata-storage structure of the primary memory cell portion of thatsplit-gate memory cell is isolated from the data-storage structure ofthe assist memory cell portion of that split-gate memory cell.
 9. Thememory of claim 8, wherein, for each split-gate memory cell of theplurality of strings of series-connected split-gate memory cells, thedata-storage structure of the primary memory cell portion of thatsplit-gate memory cell comprises a first conductive structure and thedata-storage structure of the assist memory cell portion of thatsplit-gate memory cell comprises a second conductive structure.
 10. Thememory of claim 1, wherein, for each split-gate memory cell of theplurality of strings of series-connected split-gate memory cells, achannel region of the primary memory cell portion of that split-gatememory cell is in communication with a channel region of the assistmemory cell portion of that split-gate memory cell.
 11. A memory,comprising: an array of memory cells comprising a plurality of stringsof series-connected split-gate memory cells, wherein each split-gatememory cell of the plurality of strings of series-connected split-gatememory cells comprises a primary memory cell portion and an assistmemory cell portion; a plurality of primary access lines, wherein eachprimary access line of the plurality of primary access lines isconnected to a control gate of the primary memory cell portion of arespective split-gate memory cell of each string of series-connectedsplit-gate memory cells of the plurality of strings of series-connectedsplit-gate memory cells; a plurality of assist access lines, whereineach assist access line of the plurality of assist access lines isconnected to a control gate of the assist memory cell portion of itsrespective split-gate memory cell of each string of series-connectedsplit-gate memory cells of the plurality of strings of series-connectedsplit-gate memory cells; and a controller for access of the array ofmemory cells; wherein, during an erase operation on the plurality ofstrings of series-connected split-gate memory cells, the controller isconfigured to cause the memory to: actively bias each primary accessline of the plurality of primary access lines while applying an erasevoltage to each string of series-connected split-gate memory cells ofthe plurality of strings of series-connected split-gate memory cells;and electrically float each assist access line of the plurality ofassist access lines while applying the erase voltage to each string ofseries-connected split-gate memory cells of the plurality of strings ofseries-connected split-gate memory cells.
 12. The memory of claim 11,wherein the controller being configured to cause the memory to activelybias each primary access line of the plurality of primary access lineswhile applying the erase voltage comprises the controller beingconfigured to cause the memory to actively bias a particular primaryaccess line of the plurality of primary access lines with a voltagelevel configured to remove charge from a data-storage structure of eachprimary memory cell portion connected to the particular primary accessline.
 13. The memory of claim 11, wherein the controller beingconfigured to cause the memory to actively bias each primary access lineof the plurality of primary access lines while applying the erasevoltage comprises the controller being configured to cause the memory toactively bias each primary access line of the plurality of primaryaccess lines with a respective voltage level configured to remove chargefrom a data-storage structure of each primary memory cell portionconnected to that primary access line.
 14. The memory of claim 11,wherein, for each split-gate memory cell of the plurality of strings ofseries-connected split-gate memory cells, the assist memory cell portionof that split-gate memory cell has a positive threshold voltage.
 15. Thememory of claim 14, wherein, for at least one split-gate memory cell ofthe plurality of strings of series-connected split-gate memory cells,the primary memory cell portion of that split-gate memory cell has anegative threshold voltage.
 16. A memory, comprising: an array of memorycells comprising a plurality of strings of series-connected split-gatememory cells, wherein each split-gate memory cell of the plurality ofstrings of series-connected split-gate memory cells comprises a primarymemory cell portion and an assist memory cell portion; a plurality ofprimary access lines, wherein each primary access line of the pluralityof primary access lines is connected to a control gate of the primarymemory cell portion of a respective split-gate memory cell of eachstring of series-connected split-gate memory cells of the plurality ofstrings of series-connected split-gate memory cells; a plurality ofassist access lines, wherein each assist access line of the plurality ofassist access lines is connected to a control gate of the assist memorycell portion of its respective split-gate memory cell of each string ofseries-connected split-gate memory cells of the plurality of strings ofseries-connected split-gate memory cells; and a controller for access ofthe array of memory cells; wherein, during a read operation on aselected split-gate memory cell of a particular string ofseries-connected split-gate memory cells of the plurality of strings ofseries-connected split-gate memory cells, the controller is configuredto cause the memory to: apply a first voltage level to a selectedprimary access line of the plurality of primary access lines that isconnected to the control gate of the primary memory cell portion of theselected split-gate memory cell, wherein the first voltage level isconfigured to selectively activate the primary memory cell portion ofthe selected split-gate memory cell depending upon its data state; applya second voltage level to a selected assist access line of the pluralityof assist access lines that is connected to the control gate of theassist memory cell portion of the selected split-gate memory cell,wherein the second voltage level is configured to deactivate the assistmemory cell portion of the selected split-gate memory cell; and apply athird voltage level to an unselected assist access line of the pluralityof assist access lines that is connected to the control gate of theassist memory cell portion of an unselected split-gate memory cell ofthe read operation, wherein the third voltage level is configured toactivate the assist memory cell portion of the unselected split-gatememory cell.
 17. The memory of claim 16, wherein the controller beingconfigured to cause the memory to apply the third voltage level to theunselected assist access line comprises the controller being configuredto cause the memory to apply the third voltage level to each assistaccess line of the plurality of assist access lines other than theselected assist access line.
 18. The memory of claim 16, wherein thecontroller is further configured to cause the memory to apply the thirdvoltage level to an unselected primary access line of the plurality ofprimary access lines that is connected to the control gate of theprimary memory cell portion of the unselected split-gate memory cell,wherein the third voltage level is configured to activate the primarymemory cell portion of the unselected split-gate memory cell.
 19. Thememory of claim 18, wherein the controller being configured to cause thememory to apply the third voltage level to the unselected primary accessline comprises the controller being configured to cause the memory toapply the third voltage level to each primary access line of theplurality of primary access lines other than the selected primary accessline.
 20. The memory of claim 16, wherein, for each split-gate memorycell of the plurality of strings of series-connected split-gate memorycells, the assist memory cell portion of that split-gate memory cell hasa positive threshold voltage.
 21. The memory of claim 20, wherein, forat least one split-gate memory cell of the plurality of strings ofseries-connected split-gate memory cells, the primary memory cellportion of that split-gate memory cell has a negative threshold voltage.